发明名称 |
VERTICAL TRANSISTOR FOR RESISTIVE MEMORY |
摘要 |
The present disclosure relates to a method of making a memory on semiconductor substrate, comprising: at least one data line, at least one selection line, at least one reference line, at least one memory cell comprising a select transistor having a control gate connected to the selection line, a first conduction terminal connected to a variable impedance element, the select transistor and the variable impedance element coupling the reference line to the data line, the select transistor comprising an embedded vertical gate produced in a trench formed in the substrate, and a channel region opposite a first face of the trench, between a first deep doped region and a second doped region on the surface of the substrate coupled to the variable impedance element. |
申请公布号 |
US2016329490(A1) |
申请公布日期 |
2016.11.10 |
申请号 |
US201615214054 |
申请日期 |
2016.07.19 |
申请人 |
STMICROELECTRONICS (ROUSSET) SAS |
发明人 |
BOIVIN Philippe;DELALLEAU Julien |
分类号 |
H01L43/12;H01L27/115;H01L27/22;H01L29/423;H01L21/762;H01L45/00;H01L43/02;H01L43/08;H01L21/265;H01L27/24;H01L29/78 |
主分类号 |
H01L43/12 |
代理机构 |
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代理人 |
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主权项 |
1. A method, comprising:
manufacturing an integrated circuit including a memory with a memory cell, the manufacturing including: implanting deep down in a semiconductor substrate a first doped region, producing a trench in the substrate, from an upper face of the substrate, and which reaches the first doped region, producing an embedded gate in the trench, implanting on a first side of the trench, adjacent to the upper face of the substrate, a second doped region that forms a first conduction region of a select transistor having a gate that is the embedded gate and having a second conduction region that is the first doped region, and forming a variable impedance element electrically coupled to the second doped region. |
地址 |
Rousset FR |