A SOLID STATE LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING A SOLID STATE LIGHT EMITTING DEVICE

摘要

A solid state light emitting device includes a light emitting stack (20), a metallization (30), comprising a guard layer (36) of metal, and a dielectric layer (50) over the guard layer (36) of the metallization. During subsequent processing delamination and/or cracking may occur at the edges of the devices, sometimes referred to as die edge defects. To address these defects a plurality of stress-relief elements (62, 64) and/or anchor elements may be provided in an edge region of the metallization and/or dielectric layer for reducing delamination. The stress-relief elements (62, 64) are formed by regions of reduced thickness or increased thickness in the guard layer (36).

主权项

1. A solid state light emitting device, comprising:
a light emitting stack of a plurality of semiconductor layers; a metallization on the light emitting stack including at least one metallization layer and comprising a guard layer of metal; a dielectric layer on the guard layer of the metallization; a plurality of stress-relief elements and/or anchor elements in an edge region of the metallization and/or dielectric layer, the edge region being the region of the solid state light emitting device adjacent to the edge of the solid state light emitting device, wherein the stress-relief elements are formed by regions of increased thickness or reduced thickness in the guard layer.