LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode (LED) package includes a package board having a first surface having a plurality of chip mounting regions and a second surface opposing the first surface, and including a plurality of first and second through electrodes disposed in the plurality of chip mounting regions, a plurality of LED chips disposed in the plurality of chip mounting regions of the first surface of the package board and each having one surface on which first and second electrodes are disposed, wherein the first and second electrodes are connected to the first and second through electrodes positioned in the chip mounting regions, and a connection electrode disposed on at least one of the first surface and the second surface of the package board, and connecting the first and second through electrodes.

主权项

1. A light emitting diode (LED) package comprising:
a package board having a first surface having a plurality of chip mounting regions and a second surface opposing the first surface, and including a plurality of first and second through electrodes electrically connecting the first surface and the second surface and disposed in the plurality of chip mounting regions; a plurality of integral LED chips disposed in the plurality of chip mounting regions of the first surface of the package board and each having one surface on which first and second electrodes are disposed, wherein the first and second electrodes are connected to the first and second through electrodes positioned in the chip mounting regions; and a connection electrode disposed on at least one of the first surface and the second surface of the package board, and connecting the first and second through electrodes of adjacent chip mounting regions so that the plurality of integral LED chips are connected.