发明名称 |
LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE |
摘要 |
Disclosed are a light-emitting diode and a method for manufacturing a light-emitting diode. The method includes: a base layer; a circuit layer formed on the base layer; a light-emitting chip formed on the circuit layer; electrode pads formed on the base layer and electrically connected to the light-emitting chip so that the electrode pads and the circuit layer and the light-emitting chip are spaced from each other by first spacing distances and the electrode pads and the circuit layer and the light-emitting chip define therebetween first grooves, where an altitude of the electrode pad is equal to an altitude of the light-emitting chip; and a phosphor powder contained package layer formed on the light-emitting chip and the electrode pads and filled into the first grooves between the electrode pads and the circuit layer to form a uniform dome shape. |
申请公布号 |
US2016343923(A1) |
申请公布日期 |
2016.11.24 |
申请号 |
US201414426455 |
申请日期 |
2014.12.12 |
申请人 |
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO,. LTD. |
发明人 |
ZHOU Gege |
分类号 |
H01L33/62 |
主分类号 |
H01L33/62 |
代理机构 |
|
代理人 |
|
主权项 |
1. A light-emitting diode, comprising:
a base layer; a light-emitting chip, which is formed on the circuit layer; electrode pads, which are formed on the base layer and are electrically connected to the light-emitting chip, the electrode pads and the circuit layer and the light-emitting chip being spaced from each other by predetermined first spacing distance so that the electrode pads and the circuit layer and the light-emitting chip define therebetween first grooves, the electrode pads having an altitude that is equal to an altitude of the light-emitting chip; and a phosphor powder contained package layer, which is formed on the light-emitting chip and the electrode pads and is filled into the first grooves between the electrode pads and the circuit layer to form a uniform dome shape. |
地址 |
Shenzhen, Guangdong CN |