ADHESIVE SHEET, DICING TAPE-INTEGRATED ADHESIVE SHEET, FILM, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: an adhesive sheet which can effectively dissipate heat generated in a chip to a lead frame; a dicing tape-integrated adhesive sheet including such an adhesive sheet; and a film.SOLUTION: The present invention relates to an adhesive sheet. When the adhesive sheet of the invention is used to form a device having a lead frame, an adhesion layer disposed on the lead frame, and a silicon chip disposed on the adhesion layer, the interface heat resistance of the adhesion layer and the lead frame is 0.15 K/W or less, and the total heat resistance is 0.55 K/W or less. The total heat resistance is a sum total of the interface heat resistance and the internal heat resistance of the adhesion layer.SELECTED DRAWING: Figure 1