| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate capable of removing heat of a laminate of a semiconductor element by phase change of a coolant.SOLUTION: The substrate includes: a laminate of a semiconductor element; a first fluid channel, for forming a path on a surface of the laminate through which a first coolant circulates; and a second channel, for forming a path through which a second coolant having a boiling point higher than that of the first coolant circulates between layers of the laminate.SELECTED DRAWING: Figure 1 |
