| 摘要 |
PROBLEM TO BE SOLVED: To provide a MECS device construction and bonding technology that enable realization of extremely robust components, which have high temperature stability, and are resistant to a medium.SOLUTION: In a component 100, a MECS device 10 is included that has a diaphragm construction 11 provided, and the diaphragm construction is formed in a layer construction on a substrate 110 of the device, and spans an opening part on a substrate rear surface. The component further has a supporting body for mounting and electrically contact-connecting the MECS device on the substrate. The MECS device is bonded to the supporting body 110 in flip flop technology, so that in the connection area, an air-tight mechanical bonding is formed between a top surface of the MECS device and a supporting body front surface. Thereby, in a contact pad 14, an electric connection part 17 is formed between the MECS device and the supporting body.SELECTED DRAWING: Figure 1a |
