| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system for improving an automated package customized system.SOLUTION: A system comprises a processor, and a data storage facility involving an order for creating one or more package layout files. Each package layout file may include a programming order for creating two-dimensional expression of a three-dimensional structure having plural small flat surfaces. The programming order is so configured as to enable the processor to specify aggregation of score line instructions, and each thereof comprises aggregation of parameters, and according to the parameters, a cutting device gives a score line to substrate aggregate.SELECTED DRAWING: Figure 7 |
