发明名称 WIRELESS IC DEVICE, RESIN MOLDING HAVING THE SAME, AND COMMUNICATION TERMINAL DEVICE HAVING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wireless IC device which reduces hindrance to a magnetic field of an antenna coil caused by an RFIC element and has excellent electric characteristics, a resin molding having the same, and a communication terminal device having the same.SOLUTION: There is provided a wireless IC device which has an element body having a first main surface and a second main surface facing the first main surface, a circuit board that is embedded in the element body and has an RFIC element having a first input/output terminal and a second input/output terminal mounted thereon, and an antenna coil that is provided on the element body and has one end connected to the first input/output terminal and the other end connected to the second input/output terminal, where the antenna coil includes two wiring patterns formed on the second main surface of the element body, and the two wiring patterns are extended to the second main surface of the element body from the circuit board and are connected to the first input/output terminal and the second input/output terminal of the RFIC element through a first conductor and a second conductor that are embedded in the element body, respectively.SELECTED DRAWING: Figure 1
申请公布号 JP2016219059(A) 申请公布日期 2016.12.22
申请号 JP20160177810 申请日期 2016.09.12
申请人 MURATA MFG CO LTD 发明人 IKEDA NAOTO;BANDAI TOSHIHARU;SAITO YOICHI
分类号 G06K19/077;H05K1/11;H05K1/16;H05K3/00;H05K3/40 主分类号 G06K19/077
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