| 发明名称 |
Method for forming electronic components |
| 摘要 |
A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips. |
| 申请公布号 |
US9530752(B2) |
申请公布日期 |
2016.12.27 |
| 申请号 |
US201314076976 |
申请日期 |
2013.11.11 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Nikitin Ivan;Palm Petteri;Mahler Joachim |
| 分类号 |
H05K13/02;H01L23/00 |
主分类号 |
H05K13/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, the method comprising:
arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate; at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant; forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips. |
| 地址 |
Neubiberg DE |
