| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which can avoid disconnection between a semiconductor chip and holding leads of the frame caused by a shock during transportation to a next step, after the chip and frame leads are bonded together with an adhesive. SOLUTION: A lead structure 6 includes holding leads 1, inner leads 2, outer leads 3 and dam leads 5. Gaps 9 surrounding the lead structure 6 are provided between the lead structure 6 and a frame member 4. For this reason, after a semiconductor chip is bonded to the holding leads 1, even when the lead frame is subjected to a shock during transportation to a next step, the shock is blocked by the gaps 9, thus avoiding disconnection of the bonded semiconductor chip from the leads 1. |
