METHOD FOR MANUFACTURING WAFER HAVING UNIFORMITY

摘要

PURPOSE: A method for manufacturing a wafer having the uniformity is provided to offer the wafer having a uniform thickness by compensating the thickness of an insulation film at an edge of the wafer. CONSTITUTION: An insulation film(11) and a photoresist are successively layered on the wafer(10). After exposing and developing the photoresist, the insulation film on a center part(a) is removed by the dry or wet etching. A surface of the wafer is etched back again in order to flatten the surface of the wafer after removing the photoresist of an edge part(b). At a silicon wafer state before a device such as a transistor is not formed on the substrate, the insulation film of the edge part is previously compensated as much as the thickness becoming thin on a process forming the insulation layer.