| 摘要 |
<p>PURPOSE: An ultra-light semiconductor package is provided to be capable of simplifying manufacturing processes, improving productivity, and reducing fabrication cost by removing a wire bonding process and a molding process. CONSTITUTION: A plurality of bumps(21) are connected to the back side of a semiconductor chip(20) for being capable of mutually transferring electric signal between the semiconductor chip and the outside. The bumps are loaded on the upper portion of a heat sink(10) for being capable of transferring the electric signal to leads(11) protruded from the lower portion of the heat sink through a circuit pattern(12) formed in the heat sink. The lateral portion of the semiconductor chip is surrounded by a nonconducting epoxy part(30). Preferably, the bump is made of gold.</p> |
