| 摘要 |
The present invention discloses a laser dicing apparatus for a silicon wafer and a dicing method thereof, wherein firstly, a silicon wafer, which has multiple chips with a scribed line drawn between every two chips, is provided; next, the silicon wafer is disposed on a working table having a vacuum device and fixed by the vacuum device; next, the working table and a laser are positioned by a control device; next, the laser is directed by a light-guide device to focus at one of the scribed lines; and lastly, the scribed lines on the silicon wafer are sequentially cut by the laser in order to dice the silicon wafer into multiple separate chips. The present invention can reduce the cutting harm on chips, lower the cost, accelerate the fabrication and improve environmental problems.
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