| 摘要 |
Example embodiments may provide metal line structures, and example methods may include forming the same. Example embodiment metal line structures may include a first metal line on a substrate, a first barrier metal layer on sidewalls and a lower surface of the first metal line, a first insulating layer covering the first metal line, a second metal line on the first insulating layer, a contact plug passing through the first insulating layer to electrically connect the first metal line and the second metal line, and a second barrier metal layer on sidewalls and a lower surface of the contact plug and the second metal line. The first barrier metal layer and the second barrier metal layer may contact each other.
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