| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate capable of effectively protecting a semiconductor element (especially semiconductor chip) mounted to the wiring substrate from static electricity. <P>SOLUTION: The wiring substrate is provided with an insulating layer L2, a conductive layer Lc2 laminated on the insulating layer L2 and an insulating layer L1 laminated on the conductive layer Lc2. In this case, the conductive layer Lc2 is connected to grounding potential and constituted so as to comprise a plane unit 20 constituted so as to be flat in the plane of a wiring substrate SUB and a plurality of projecting units 21 extending from the plane unit toward the side surface of the wiring substrate SUB. Projecting surfaces 22 constituting the tip of the projected units 21 are exposed on the side surface of the wiring substrate SUB and a plurality of the projecting surfaces 22 are formed on the side surface of the wiring substrate SUB. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
