发明名称 ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic device that is able to prevent cracking in solder even if a base plate is deformed.SOLUTION: An electronic device 300 comprises a base plate 332 and a MOS module 310. The base plate 332 has a through-hole 338 and a land 340. The MOS module 310 has a body part 312 and a lead terminal 314. The lead terminal 314 has a hold part 314a, counter part 314c, and base part 314b. The counter part 314c is counter to the land 340 in a direction orthogonal to the direction of the plate thickness of the base plate 332 and is solder-joined to the land 340. The base part 314b is extended from the body part 312 and connects the hold part 314a and counter part 314c. At least part of a cross-sectional area of the base part 314b is set smaller than a cross-sectional area of the counter part 314c.SELECTED DRAWING: Figure 2
申请公布号 JP2016093062(A) 申请公布日期 2016.05.23
申请号 JP20140228277 申请日期 2014.11.10
申请人 DENSO CORP 发明人 KADONO KIMIO;WATANABE YUJI;KAMIYA TAKASHI
分类号 H02G3/16;H05K1/18 主分类号 H02G3/16
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