发明名称 インクジェットヘッド基板の加工方法
摘要 Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate.
申请公布号 JP5921186(B2) 申请公布日期 2016.05.24
申请号 JP20110283357 申请日期 2011.12.26
申请人 キヤノン株式会社 发明人 古澤 健太;松本 圭司;岸本 圭介;浅井 和宏;小山 修司
分类号 B41J2/16 主分类号 B41J2/16
代理机构 代理人
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