| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve problems concerning the conventional wire bonding device that the operability of a device is reduced by correction of positional relation between a bonding tool and a wire, a bonding tool and a wire are not always corrected in appropriate positional relation, and the occurrence of defective bonding cannot be prevented completely. <P>SOLUTION: A wire bonding method includes: a step of recognizing a relative position of a wire 6 to the tip end 51 of a bonding tool 5 before the bonding tool 5 is grounded to a workpiece 11 during bonding operation of the wire bonding device 1; a step of calculating a displacement quantity of the relative position from a reference position and to determine whether the displacement quantity exceeds a tolerance; and a step of correcting the displacement of the wire 6 if the displacement quantity exceeds the tolerance. In the step of correcting the displacement, the bonding tool 5 is moved to a displacement correction portion 8a of a wire displacement correction device 8 formed on a recessed surface, and the wire 6 is pressed down to the displacement correction portion 8a by the bonding tool 5, so as to correct its displacement. <P>COPYRIGHT: (C)2009,JPO&INPIT |
