Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet

摘要

The present invention provides a heat-curing resin composition which is curable without UV irradiation or the like and in which exudation of unreacted epoxy resin and the like at the time of pressure thermoforming is satisfactory. The heat-curing resin composition comprises: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for the epoxy resin, wherein the curing agent contains organic acid dihydrazide, and part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group.

主权项

1. A heat-curing resin composition for producing a heat-curing adhesive sheet on a base film, comprising:
an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an organic solvent; an epoxy resin; and a curing agent comprising organic acid dihydrazide for said epoxy resin, wherein 3 to 12% of the epoxy groups of the acrylic copolymer are cross-linked by a liquid polyamine or a liquid polyamidoamine before forming as a heat-curing adhesive sheet, each having at least a primary amino group or a secondary amino group, and wherein an amount of the epoxy resin used is 5 to 30 parts by mass with respect to 100 parts by mass of the acrylic copolymer.