| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent short circuiting and lead drop-off, when a semiconductor device is to be packaged. <P>SOLUTION: The semiconductor device includes: a tab 5 for supporting a semiconductor chip 8; a sealing portion 12 formed by sealing the semiconductor chip 8 with resin; a tab suspension lead 4 for supporting the tab 5; a plurality of leads 2 which have portions to be connected exposed in the circumference of the backside of the sealing portion 12 and thin portions formed in a tab side end portion with a thickness smaller than that of the portions to be connected and have inner trenches and outer trenches 2f provided in wire connection planes 2d placed in the sealing member 12 of the portion to be connected; and wires 10 for connecting pads 7 of the semiconductor chip 8 and the leads 2. The thin portions of the leads 2 are covered with sealing resin, and the wires 10 are connected to the portion to be connected between the outer trenches 2f and the inner trenches 2e, and the leads are prevented from drop off by the thin portions of the leads 2, the outer trenches 2f, and the inner trenches 2e. <P>COPYRIGHT: (C)2009,JPO&INPIT |
