发明名称 TOOL FOR FILM DEPOSITION TREATMENT, PLASMA CVD SYSTEM, METAL PLATE, AND OSMIUM FILM DEPOSITION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a tool for film deposition treatment by which a thin film is deposited on a plate having a through-hole extremely small in diameter by one-time plasma deposition processing. <P>SOLUTION: The tool 8 for film deposition treatment includes: a holding member 39 for holding an aperture plate 107 having a through-hole in the state of exposing the front surface and rear surface of the aperture plate through the through-hole; and an electrode member attached with the holding member. The electrode member is electrically connected to the electrode applied with the plasma electric power of the plasma CVD system. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009149949(A) 申请公布日期 2009.07.09
申请号 JP20070329867 申请日期 2007.12.21
申请人 UTEC:KK;DAIWA TECHNO SYSTEMS:KK 发明人 SHIRATO TAKESHI;HONDA YUJI;SATO HIROSHI;OSAWA MASAMICHI
分类号 C23C16/06;C23C16/50;H01L21/285 主分类号 C23C16/06
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