发明名称 |
TOOL FOR FILM DEPOSITION TREATMENT, PLASMA CVD SYSTEM, METAL PLATE, AND OSMIUM FILM DEPOSITION METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tool for film deposition treatment by which a thin film is deposited on a plate having a through-hole extremely small in diameter by one-time plasma deposition processing. <P>SOLUTION: The tool 8 for film deposition treatment includes: a holding member 39 for holding an aperture plate 107 having a through-hole in the state of exposing the front surface and rear surface of the aperture plate through the through-hole; and an electrode member attached with the holding member. The electrode member is electrically connected to the electrode applied with the plasma electric power of the plasma CVD system. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009149949(A) |
申请公布日期 |
2009.07.09 |
申请号 |
JP20070329867 |
申请日期 |
2007.12.21 |
申请人 |
UTEC:KK;DAIWA TECHNO SYSTEMS:KK |
发明人 |
SHIRATO TAKESHI;HONDA YUJI;SATO HIROSHI;OSAWA MASAMICHI |
分类号 |
C23C16/06;C23C16/50;H01L21/285 |
主分类号 |
C23C16/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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