| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus capable of continuously forming a deposition film by a process high in the availability of materials and excellent in productivity. <P>SOLUTION: As for the vacuum deposition apparatus, where a substrate 4 is run in a vacuum tank, and a deposition film of a deposition raw material is continuously formed on the substrate 4, in the optional apparatus cross-section in the width direction of the substrate, provided that an angle made by a straight line connecting the substrate from the center of the evaporation face of an evaporation source and the normal in the deposition face of the substrate at a point on which the straight line is crossed with the substrate 4 is defined as an incident angle, the apparatus is composed of a first curve running section 64 running the substrate 4 along the curve and a first straight line running section 65 running the substrate 4 along the straight line, is composed of a first deposition region 60 in which the incident angle is tilted from the normal, a second curve running section 66 running the substrate 4 along the curve and a second straight line running section 67 running the substrate 4 along the straight line, and has a second deposition region 61 in which the incident angle is tilted from the normal, and the deposition face in the first deposition region and the deposition face in the second deposition region are arranged so as to be confronted with both sides of the normal passing through the evaporation face. <P>COPYRIGHT: (C)2009,JPO&INPIT |
