| 摘要 |
The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe3+ ions, ii) at least a source of Br - ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula (I) wherein R1 is selected from the group consisting of hydrogen, C1-C5-alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C1-C5-alkyl or C1-C5-alkoxy; R3, R4 are selected from the group consisting of hydrogen and C1-C5-alkyl; and X- is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition. |
