USE OF METAL PHOSPHORUS IN METALLIZATION OF PHOTOVOLTAIC DEVICES AND METHOD OF FABRICATING SAME

摘要

A photovoltaic device, such as a solar cell, including a copper-containing-grid metallization structure that contains a metal phosphorus layer as a diffusion barrier is provided. The copper-containing-grid metallization structure includes, from bottom to top, an electroplated metal phosphorus layer that does not include copper or a copper alloy located within a grid pattern formed on a front side surface of a semiconductor substrate, and an electroplated copper-containing layer. A method of forming such a structure is also provided.

主权项

1. A method of forming a photovoltaic device comprising:
providing a semiconductor substrate including a p-n junction with a p-type semiconductor portion and an n-type semiconductor portion one on top of the other, wherein an upper exposed surface of one of the semiconductor portions represents a front side surface of the semiconductor substrate; forming patterned antireflective coatings on the front side surface of the semiconductor substrate to provide a grid pattern on the front side surface, said grid pattern comprising exposed portions of the front side surface of the semiconductor substrate; electrodepositing a metal phosphorus layer on the exposed portions of the front side surface of the semiconductor substrate; and electrodepositing a copper-containing layer atop the metal phosphorus layer.