MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS

摘要

A screen oxide film is formed on an n− drift layer (2) that is disposed on an anterior side of an n-type low-resistance layer (1), and a nitride film is formed on the screen oxide film. The nitride film is photo-etched using a first mask and thereby, a nitride shielding film (61) is formed. N-type impurity ions at a concentration higher than that of the n− drift layer are implanted through the nitride shielding film (61) from an anterior side of a semiconductor substrate and are thermally diffused and thereby, an n counter layer (7) is formed. The screen oxide film is removed. A gate oxide film (3a) is formed. A gate electrode (9) is formed on the gate oxide film (3a). P-type impurity ions are implanted from the anterior side of the semiconductor substrate using the gate electrode (9) and the nitride shielding film (61) as a mask and thereby, p− well regions (10) are formed. N-type impurity ions are implanted from the anterior side of the semiconductor substrate using the gate electrode (9) and the nitride shielding film (61) as a mask and thereby, n source regions (11) are formed.

主权项

1. A manufacturing method of a semiconductor apparatus, comprising:
forming a control electrode through a first insulating film in a surface layer on a top side of a first semiconductor region of a first conductivity, the first semiconductor region being provided in a substrate, and forming a shielding film such that a region between the shielding film and the control electrode is a region to accommodate a third semiconductor region of the first conductivity; forming a second semiconductor region of a second conductivity in a surface layer of the first semiconductor region using the shielding film and the control electrode as a mask and selectively forming a third semiconductor region in a surface layer of the second semiconductor region using again the shielding film and the control electrode as the mask; forming a second insulating film to cover the control electrode and removing the shielding film; forming a high concentration region of the second conductivity by implanting impurity ions of the second conductivity using an accelerating voltage that permits the impurity ions to penetrate the third semiconductor region, from the surface layer of the second semiconductor region using the second insulating film as a mask, after forming the second insulating film and removing the shielding film; forming a first electrode to contact the third semiconductor region and to be insulated from the control electrode by the second insulating film; and forming a second electrode on a back side of the first substrate, wherein the control electrode is disposed over a part of the second semiconductor region that is sandwiched between the first semiconductor region and the third semiconductor region, and wherein at the forming the second insulating film and removing the shielding film, a portion of the shielding film is left on the second insulating film.