SELF-ALIGNED VIA INTERCONNECT STRUCTURES

摘要

A self-aligned via interconnect structures and methods of manufacturing thereof are disclosed. The method includes forming a wiring structure in a dielectric material. The method further includes forming a cap layer over a surface of the wiring structure and the dielectric material. The method further includes forming an opening in the cap layer to expose a portion of the wiring structure. The method further includes selectively growing a metal or metal-alloy via interconnect structure material on the exposed portion of the wiring structure, through the opening in the cap layer. The method further includes forming an upper wiring structure in electrical contact with the metal or metal-alloy via interconnect structure.

主权项

1. A method, comprising:
forming a wiring structure in a dielectric layer; depositing a dielectric cap layer over the wiring structure and the dielectric layer; etching an opening in the dielectric layer, exposing a surface of the wiring structure; forming a self-aligned via interconnect structure in direct electrical contact with the metal material of the wiring structure by overfilling the opening larger than the opening with a metal or metal-alloy growth process; depositing an interlevel dielectric material over the self-aligned via interconnect structure and the dielectric cap layer; etching a trench within the interlevel dielectric material to expose one or more surfaces of the self-aligned via interconnect structure; depositing a barrier material and liner material over the exposed one or more surfaces of the self-aligned via interconnect structure and on sidewalls of the trench; and electroplating a metal or metal-alloy material on the liner material to complete formation of an upper wiring structure, in electrical contact with the via interconnect structure.