发明名称 |
REDUCED EXTERNAL RESISTANCE FINFET DEVICE |
摘要 |
The present invention relates generally to semiconductor devices, and more particularly, to a structure and method of reducing external resistance within fin field effect transistor (finFET) devices. A first spacer and a second spacer may be formed adjacent to a gate which may reduce capacitance in a substantial portion of a epitaxial source-drain region while also permitting a portion of the epitaxial source-drain region to be located close to a channel. By reducing capacitance from the gate on the substantial portion of the epitaxial source-drain region, resistance in the epitaxial source-drain region may be reduced which may result in increased device performance. |
申请公布号 |
US2016196973(A1) |
申请公布日期 |
2016.07.07 |
申请号 |
US201514591041 |
申请日期 |
2015.01.07 |
申请人 |
International Business Machines Corporation |
发明人 |
Cheng Kangguo;Ponoth Shom S.;Sreenivasan Raghavasimhan;Standaert Theodorus E.;Yamashita Tenko |
分类号 |
H01L21/02;H01L29/161;H01L29/78;H01L29/66 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming an epitaxial source-drain region around a fin, the epitaxial source-drain region having a first epitaxial layer adjacent to and contacting a sidewall of a first spacer and below a second spacer and a second epitaxial layer on the first epitaxial layer adjacent to and contacting a sidewall of the second spacer, wherein the first spacer is adjacent to and contacting a sidewall of a gate, wherein the second epitaxial layer is formed on an upper surface of a substrate and around the first epitaxial layer. |
地址 |
Armonk NY US |