ELECTROLESS Ni PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless Ni plating method, capable of directly performing electroless Ni plating on a noble metal film.SOLUTION: An electroless Ni plating method comprises: a base metal film formation step of forming a base metal film 2 having an ionization tendency higher than Pd on a substrate 1; a noble metal film formation step of forming a noble metal film 3 having an ionization tendency lower than that of Pd on the base metal film; an Ni plating step of electroless-plating an Ni film 5 on the noble metal film; a step of heat-treating the noble metal film to precipitate a base metal 2a of the base metal film on the surface of the noble metal film before the Ni plating step; and a Pd film formation step of forming a Pd film 4 on the precipitated base metal by contacting the precipitated base metal with a dip liquid including Pd.SELECTED DRAWING: Figure 1