发明名称 PACKING MATERIAL
摘要 PROBLEM TO BE SOLVED: To inhibit chips from occurring from a packing material.SOLUTION: A packing material 10 disclosed by the specification houses wire harnesses 40, each of which includes a wire harness body 60 formed by binding electric wires 61 and fixed to a bracket 50. The packing material 10 includes: a frame body 11 enclosing the wire harnesses 40; and holding parts 12, each of which is formed integrally connected to the frame body 11 and the bracket 50 and supports the bracket 50 to hold the wire harness 40 in the frame body 11.SELECTED DRAWING: Figure 1
申请公布号 JP2016155585(A) 申请公布日期 2016.09.01
申请号 JP20150036151 申请日期 2015.02.26
申请人 SUMITOMO WIRING SYST LTD 发明人 MATSUNAGA TAKEHIRO
分类号 B65D85/00;B65D85/68 主分类号 B65D85/00
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