Infrared camera system housing with metalized surface

摘要

A housing for an infrared camera module may be implemented with a substantially non-metal cover configured to substantially or completely enclose various components of an infrared imaging device. A metal layer may be disposed on various interior and/or exterior surfaces of the cover. Such implementations may be used to reduce the effects of various environmental conditions which may otherwise adversely affect the performance of the infrared imaging device. In addition, one or more conductive traces may be built into the housing and/or on interior surfaces of the housing to facilitate the passing of signals from components of the infrared imaging device such as infrared sensors, read out circuitry, a temperature measurement component, and/or other components. One or more fiducial markers may be provided to align various components of the infrared camera module during manufacture.

主权项

1. An apparatus comprising:
a housing adapted to receive an infrared sensor assembly comprising a plurality of infrared sensors configured in a focal plane array to capture thermal images of a target scene, the housing comprising: a cover comprising a majority of non-metal material; a metal layer with disposed on a majority of interior and/or exterior surfaces of the cover; and wherein the metal layer exhibits a higher thermal conductivity than the cover which reduces non-uniform heating of the infrared sensor assembly, wherein the metal layer is adapted to attenuate electromagnetic interference emitted by the infrared sensor assembly and shield the infrared sensor assembly from electromagnetic interference incident on the cover.