| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device capable of preventing trouble from occurring to an unexpected part as an overcurrent flows owing to a surface-mounted element bonded directly to a lead frame. <P>SOLUTION: The circuit device includes: a capacitor 61 having two terminals; lead frames 20 and 30 having the terminals of the capacitor 61 bonded directly to terminal bonding portions respectively; and a sealing material 80 sealing the capacitor 61 and lead frames 20 and 30. The lead frames 20 and 30 have: support portions which can be clamped and supported when sealed with the sealing material 80; a disconnected portion (between the lead frames 30 and 40) which is formed by cutting electrically a region electrically in series with the capacitor 61; and a bonding wire 71 which electrically connects the disconnected portion of the lead frames, and is blown-out with a lower current than the current with which the lead frames 20, 30 and 40 are blown-out. <P>COPYRIGHT: (C)2009,JPO&INPIT |
