| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package capable of reducing the occurrence of a malfunction such as the breakage and curvature of a semiconductor substrate in a region where a cavity is formed even if the cavity is present over an imaging element and then the semiconductor substrate becomes thinner, and a camera module. <P>SOLUTION: On a first principal surface of a silicon substrate 10, a solid-state imaging element 12 and an element surface electrode 27 are formed. A through-electrode is formed so as to penetrate the silicon substrate 10 between a second principal surface facing the element surface electrode 27 formed on the first principal surface, and the first principal surface. A glass substrate 30 is formed via a patterned adhesive 20 so that the cavity 18 is formed over the solid-state imaging element 12. Then, the silicon substrate 10 below the cavity 18 is formed thinner than the silicon substrate 10 below the adhesive 20 when viewed from the glass substrate 30. <P>COPYRIGHT: (C)2009,JPO&INPIT |
