Method of attaching solid state imaging device

摘要

First, a CCD package is attached to a plane of a flexible substrate. A reference plane, which is parallel to an image forming plane of a solid state imaging device chip, is formed at the top of the CCD package. The reference plane is brought into contact with a reference plane of an optical unit, and a leaf spring presses the CCD package so that the CCD package can be fixed to the optical unit.