发明名称 SPRAY NOZZLE AND EQUIPMENT FOR FABRICATING SEMICONDUCTOR HAVING THE SAME
摘要 A spray nozzle is provided to prevent developer from being dropped from a spray nozzle to a substrate after a developer supply process is completed and avoid generation of air bubbles in a subsequent process by preventing developer from leaking by a switching unit and a pressurization unit of the spray nozzle as a developer supply to the spray nozzle stops. A hollow hole(212) is formed in a body(230). One end of a switching unit(220) is exposed to the outside of the body, connected to an exhaust line to which chemicals are supplied. The other end of the switching unit is inserted into the hollow hole to selectively supply or block the chemicals according to a fluid pressure of the chemicals. A pair of pressurization units(240) are installed in a predetermined portion of the body to be closely attached to the outer sidewalls of the switching unit and selectively pressurize the switching unit according to a fluid pressure of the chemicals. A fluid dispersing unit(250) disperses the chemicals to the outside, installed in the hollow hole in the lower part of the switching unit.
申请公布号 KR20050028742(A) 申请公布日期 2005.03.23
申请号 KR20030065265 申请日期 2003.09.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SUNG HUN
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址