| 摘要 |
The invention relates to a method and a device for cooling ultrasonic transducers. The inventive device is characterised in that it consists of at least one piezo stack ( 4 ) and at least two cylindrical transducer bodies ( 5 ), which together with the piezo stack ( 4 ) form an lambda/2 oscillator. In multiple transducer assemblies, two respective transducer bodies ( 5 ) can be combined to form a common transducer body ( 6 ) and the transducer bodies ( 5, 6 ) comprise flow channels ( 7 ), through which pressurised coolant can flow. The inventive method for cooling ultrasonic transducers is characterised in that the body of the ultrasonic transducer is traversed and/or surrounded by a pressurised coolant. This enables the heat that is generated in the transducers to be directly dissipated by convection. In addition the inventive elements enable the creation of a large common contact surface between the transducers and the coolant. The heat dissipation achieved is substantially more effective than in known methods and the inventive elements thus guarantee a high-performance continuous operation.
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