SUBSTRATE INCORPORATED WITH COMPONENTS, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate incorporated with components inexpensively with high reliability, which obtains high-density packaging with high substrate dimension accuracy, and to provide its manufacturing method.

SOLUTION: The substrate incorporated with components is characterized by comprising: a first electrically insulating substrate 1; a plurality of circuit boards 4 comprising a wiring pattern 2 formed on both sides of the first electrically insulating substrate 1 and arranged on the same plane; a circuit component 6 mounted on the circuit board 4; a correcting material 8 with a thermal expansion coefficient lower than that of the circuit board 4; and a second electrically insulating substrate 7 having the circuit component 6 embedded to bond a plurality of circuit boards 4 that are arranged on the same plane with the correcting material 8.

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