| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate and an illumination device capable of restraining temperature rise by discharging heat generated at a semiconductor light-emitting device. <P>SOLUTION: A number of chip LEDs can be mounted on a surface of the substrate 1, and a mounting region of each chip LED is arranged with a given separation dimension. An area of the mounting region corresponds to a region occupied by the chip LED on the substrate 1. On a back face of the substrate 1, a plurality of radiation thermal conduction films 3,... for radiating heat generated at chip LEDs to outside of the substrate 1, are provided with given separation dimensions. An area of the thermal conduction film 3 is larger than that of the mounting region, and is arranged so as to surround the area of the mounting region. The radiation thermal conduction films 3,..., for instance, can be formed by patterning copper foil formed on a whole back face of the substrate 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
