An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.
申请公布号
US2009026590(A1)
申请公布日期
2009.01.29
申请号
US20070781788
申请日期
2007.07.23
申请人
NATIONAL SEMICONDUCTOR CORPORATION
发明人
LIM PENG SOON;YII TERH KUEN;ZIN MOHD SABRI;PHAM KEN
