发明名称 CONDUCTIVE SCRIM EMBEDDED STRUCTURAL ADHESIVE FILMS
摘要 Systems and methods for providing a structural adhesive film that includes a conductive scrim layer are disclosed. In one embodiment, a method for producing a structural adhesive film includes providing a first resin adhesive layer. The first resin adhesive layer is configured to bind to a first carbon fiber ply. The method also includes providing a second resin adhesive layer. The second adhesive layer is configured to bind to a second carbon fiber ply. The method also includes providing a conductive scrim that is embedded between the first resin adhesive layer and the second resin adhesive layer. In some embodiments, the conductive scrim is infused with resin adhesive.
申请公布号 EP2183330(B1) 申请公布日期 2016.10.05
申请号 EP20080798374 申请日期 2008.08.21
申请人 THE BOEING COMPANY 发明人 ACKERMAN, PATRICE K.
分类号 C09J7/00 主分类号 C09J7/00
代理机构 代理人
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