| 摘要 |
The present invention relates to a method for preparing a MEMS device, the method comprising: a step for preparing a MEMS device comprising a MEMS device layer, on which a MEMS device is formed, a MEMS handle layer, and an insulating layer which is formed between the MEMS device layer and the MEMS handle layer; a MEMS device layer patterning step for drawing a plurality of etch holes along a seal line; a step for performing etching for the plurality of etch holes that have been drawn and thus exposing the MEMS handle layer; and an Au-Si bonding step for performing Au-Si eutectic bonding, used for MEMS device preparation, and enabling liquid Au-Si alloy to enter the plurality of etching holes and cool such that the MEMS device layer and MEMS handle layer are electrically connected. |
