POWER SYSTEM-ON-CHIP ARCHITECTURE

摘要

A lighting device is provided. The lighting device includes a substrate, integrated circuits (22′, 24), embedded passive components (26, 27), and a lighting component (22), the device being arranged in an architecture having three layers: an integrated circuits layer (11) including the integrated circuits (22′, 24), wherein the integrated circuits layer (11) is integrated on a first side of the substrate; an embedded passive components layer (12) including the embedded passive components (26, 27), wherein the embedded passive components (26, 27) are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits (22′, 24) through vias (28) in the substrate; and a bonded layer (13), including the lighting component (22), the lighting component (22) being connected to the integrated circuit layer (11) through flip-chip bonding or monolithic integration.

主权项

1. A lighting device, comprising a substrate, integrated circuits, embedded passive components, and a lighting component, the device being arranged in an architecture comprising:
an integrated circuits layer comprising the integrated circuits, wherein the integrated circuits layer is integrated on a first side of the substrate; an embedded passive components layer comprising the embedded passive components, wherein the embedded passive components are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits through vias in the substrate; and a bonded layer, comprising the lighting component, the lighting component being connected to the integrated circuit layer through flip-chip bonding or monolithic integration.