发明名称 Processing apparatus
摘要 Provided is a processing apparatus for performing a processing of a substrate to be processed using a high-pressure fluid to prevent the generation of particles and ensure airtightness in the processing container. A sealing member is installed to surround a carrying port of the processing chamber, the carrying port is closed by the cover, and the cover is restricted from retreating by the pressure in the processing chamber by a lock plate, thereby processing the wafer in the processing chamber using the high-pressure fluid. Since the sealing member is pressurized by the internal atmosphere of the processing chamber to be pressed toward the cover during the drying process, a gap between the cover and the processing chamber may be airtightly closed. Since the sealing member does not slide with respect to the processing chamber or the cover, the generation of particles is suppressed.
申请公布号 US9496158(B2) 申请公布日期 2016.11.15
申请号 US201213447519 申请日期 2012.04.16
申请人 Tokyo Electron Limited 发明人 Nakashima Mikio;Inadomi Hiroaki;Okamura Satoshi
分类号 H01L21/67 主分类号 H01L21/67
代理机构 Abelman, Frayne & Schwab 代理人 Abelman, Frayne & Schwab
主权项 1. A processing apparatus comprising: a processing container configured to receive a substrate to be processed through a carrying port and process the substrate using a high-pressure fluid; a cover configured to close the carrying port with a first gap formed between the cover and the processing container when the high-pressure fluid is not supplied to the processing container, and retreat from the processing container by an internal atmosphere of the processing container when the high-pressure fluid is supplied to the processing container thereby widening the first gap; a sealing member annularly installed to surround the carrying port or fit to an inner circumferential surface of the carrying port when the carrying port is closed by the cover, having an elasticity with a U-shaped longitudinal cross section, and disposed such that an internal space surrounded in the U shape communicates with the internal atmosphere of the processing container; a restriction mechanism configured to restrict the cover from retreating by the pressure beyond a predetermined position in the processing container, wherein the restriction mechanism includes: a lock plate configured to move vertically between a locking position for pressing the cover and an opening location where the lock plate retreats downward from the locking location in order to open the cover and restrict a movement of the cover;an insertion hole where the lock plate is inserted into the insertion hole; andan elevating mechanism configured to move the lock plate, andwherein a second gap is formed between the insertion hole and the lock plate disposed at the locking location by the predetermined position; and a controller configured to control an overall operation of the processing apparatus, wherein the controller is programmed such that, when the high-pressure fluid is not supplied to the processing container, the cover airtightly closes the first gap by squashing the sealing member, and wherein the controller is further programmed such that, when the high-pressure fluid is supplied to the processing container, the sealing member is pressurized by the internal atmosphere of the processing container caused by the high-pressure fluid entering into the internal space surrounded in the U shape through the widened first gap to be pressed to at least one of the cover or the processing container, thereby a state where airtightly closing the first gap widened by the internal atmosphere of the processing container is maintained while the high-pressure fluid is being supplied.
地址 Tokyo JP