METHOD OF MACHINING COMPOUND SEMICONDUCTOR SUBSTRATE AND COMPOUND SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of machining a compound semiconductor substrate reducing the amount of warpage of the substrate.

SOLUTION: The method of machining the compound semiconductor substrate includes: a step for applying a back surface 3 at a side opposite to a polishing surface 2 of the compound semiconductor substrate 1 to a polishing plate 11 having a circular plane shape; a step for rotating the polishing plate 11; and a step for polishing the polishing surface 2 in contact with a polishing surface plate. In the application step, a projecting part 4 on the polishing surface 2 is disposed at the position of the polishing plate 11 to which a relatively large polishing load is applied in a polishing step, namely at the center side and the outermost periphery side in the radial direction of the polishing plate 11.

COPYRIGHT: (C)2009,JPO&INPIT