发明名称 |
Chemical treatment apparatus and chemical treatment method |
摘要 |
A chemical treatment apparatus including a treatment tank filled with chemical with which wafers are treated, and a jet pipe having chemical jetting holes which is provided at the bottom portion of the treatment tank and jets the chemical from the jetting holes thereof, the jetting holes containing at least first jetting holes for jetting the chemical upwardly and second jetting holes for jetting the chemical in a direction different from that of the first holes. The second direction is set to a direction within the range from the horizontal direction of the jet pipe to the obliquely downward direction at 45 degrees with respect to the horizontal direction.
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申请公布号 |
US6156153(A) |
申请公布日期 |
2000.12.05 |
申请号 |
US19980158572 |
申请日期 |
1998.09.22 |
申请人 |
SONY CORPORATION |
发明人 |
IWAMOTO, HAYATO;KUROSAWA, KIYOSHI |
分类号 |
H01L21/306;B08B3/10;H01L21/00;H01L21/304;(IPC1-7):C23F1/02;H01L21/302 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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