发明名称 |
Curable resin composition |
摘要 |
A curable resin composition includes a silane compound (a) having an epoxy group, and at least one selected from a silane compound (b) having an amino group, a silane compound (c) having a mercapto group, and a silane compound (d) having an acid anhydride group. At least a part of at least one selected from the silane compounds (a) to (d) includes a condensate. This composition has excellent heat resistance with a small change in storage modulus due to temperatures.
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申请公布号 |
US2005171318(A1) |
申请公布日期 |
2005.08.04 |
申请号 |
US20050047771 |
申请日期 |
2005.02.02 |
申请人 |
THE YOKOHAMA RUBBER CO., LTD. |
发明人 |
OKUHIRA HIROYUKI;MATSUMURA TOMOYUKI;ISHIKAWA KAZUNORI;HAMADA NATSUKI;MIURA KEIKO;HOSODA HIROYUKI;OCHI MITSUKAZU |
分类号 |
C08G59/30;C08G59/40;C08G77/04;C08G77/14;C08G77/26;C08G77/28;C08L83/06;C08L83/08;H05K1/03;(IPC1-7):C08G77/04 |
主分类号 |
C08G59/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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