| 摘要 |
A method of forming a MEMS device includes providing a first wafer having a MEMS structure in a first area and a second wafer having a second area, applying a metal nanoparticle material between the first wafer and the second wafer, and bonding a portion of the first wafer to a portion of the second wafer with the metal nanoparticle material so as to form a sealed area in the first area and the second area.
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