| 发明名称 |
METHOD OF THERMAL STRESS COMPENSATION |
| 摘要 |
A method of thermal stress compensation includes providing a substrate. A first film is then formed on the substrate. Thereafter, a second film is also formed on the substrate. The second film has a negative coefficient of thermal expansion.
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| 申请公布号 |
US2009029048(A1) |
申请公布日期 |
2009.01.29 |
| 申请号 |
US20080247215 |
申请日期 |
2008.10.07 |
| 申请人 |
NATIONAL CENTRAL UNIVERSITY |
发明人 |
CHEN JYH-CHEN;SHEU GWO-JIUN |
| 分类号 |
C23C16/44;B05D1/36 |
主分类号 |
C23C16/44 |
| 代理机构 |
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