| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing an assembly with at least two microelectronic chips. <P>SOLUTION: An assembly of a chip 7 formed on a wafer can be formed. Each chip comprises two parallel main surfaces coupled by a side surface. At least one side surface comprises at least one groove for accommodating a thread element 17. The wafer is first pasted to a flexible film 8, and then the chip is cut. After that, the film is deformed, a gap is provided between chips, and thereby, the groove can be accessed. A daisy chain is formed by coupling the chips through at least one thread element. By inserting the thread into the groove of the chip, each chip is inserted into the daisy chain and after that, the chip is removed from the deformable film. <P>COPYRIGHT: (C)2009,JPO&INPIT |
