发明名称 DEVICE FOR APPLYING FOOD POWDER
摘要 PROBLEM TO BE SOLVED: To provide a device for applying food powder which can stick power on a surface of a ball-shaped food such as a dough ball of bread thinly and evenly and can be downsized.SOLUTION: A powder applying device covers a surface of a food molded in a ball shape with powder and sends the food to a next process, and includes an inclined passage which receives a food ball having been scattered with power from an upper side and allowing the food ball to roll downward. The inclined passage includes: a first drum 70 formed into a cylinder shape allowing the food ball to roll in a hollow part and rotated in a circumferential direction; and a second drum 71 arranged in series with respect to the first drum 70, rotated in a circumferential direction opposite to the first drum 70, and formed in to a cylinder shape allowing the food ball having passed through the first drum 70 to roll in a hollow part. Further, baffle member 75a, 75b are inserted in the first drum 70 and/or second drum 71, the baffle members arranged at positions blocking a rolling route of the food ball.SELECTED DRAWING: Figure 3
申请公布号 JP2016165229(A) 申请公布日期 2016.09.15
申请号 JP20150045611 申请日期 2015.03.09
申请人 YTC PLUS CO LTD 发明人 KAWAKAMI NOBUYUKI
分类号 A21C9/04;A23P20/00 主分类号 A21C9/04
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